학술논문
'학술논문'
에서 검색결과 36건 | 목록
1~10
Academic Journal
Papadopoulos, C.; Villiger, T.; Steiner, S.; Prinz, J.; Morabito, C.; Cammarata, M.; Rodriguez, A.; Kwon, J.; Geilenkeuser, R.; Breuer, D.; Kuechenmeister, F.; Dienelt, J.; Urban, J.; Kabus, H.; Krinke, J.
In Microelectronics Reliability November 2020 114
Academic Journal
Singh, P.K.; Rohlfs, P.; Sandmann, G.; Machani, K.V.; Wieland, M.; Breuer, D.; Meier, K.; Bock, K.; Kuechenmeister, F.
In: Advancing Microelectronics . (Advancing Microelectronics, September 2023, 2023(EMPC):345-350)
Conference
In: Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023 , Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023, 2023, :901-905)
Conference
Dudash, V.; Meier, K.; Mueller, M.; Bock, K.; Machani, K.V.; Geisler, H.; Kuechenmeister, F.; Wieland, M.
In: Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023 , Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023, 2023, :757-763)
Conference
Singh, P.K.; MacHani, K.V.; Wieland, M.; Muller, M.; Meier, K.; Bock, K.; Breuer, D.; Hecker, M.; Kuechenmeister, F.
In: 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings , 2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings. (2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings, 2023)
Conference
Dudash, V.; MacHani, K.V.; Boehme, B.; Capecchi, S.; Kuechenmeister, F.; Wieland, M.; Meier, K.; Bock, K.; Ok, J.
In: IEEE International Reliability Physics Symposium Proceedings , 2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings. (IEEE International Reliability Physics Symposium Proceedings, 2023, 2023-March)
Conference
Singh, P.K.; MacHani, K.V.; Breuer, D.; Hecker, M.; Kuechenmeister, F.; Wieland, M.; Meier, K.; Bock, K.
In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 , 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, 2023)
Academic Journal
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A IEEE Trans. Comp., Packag., Manufact. Technol. A Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on. 20(1):9-14 Mar, 1997
Conference
In: Proceedings of the International Spring Seminar on Electronics Technology , 2022 45th International Spring Seminar on Electronics Technology, ISSE 2022. (Proceedings of the International Spring Seminar on Electronics Technology, 2022, 2022-May)
Academic Journal
In: ECS Journal of Solid State Science and Technology . (ECS Journal of Solid State Science and Technology, 2015, 4(1):N3134-N3139)
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[AR] Kuechenmeister, F.
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