학술논문
'학술논문'
에서 검색결과 6건 | 목록
1~10
Academic Journal
Dworkin, M.; Agarwal-Harding, K.J.; Joseph, M.; Cahill, G.; Konadu-Yeboah, D.; Makasa, E.; Mock, C.; Born, C.; Rickard, J.; Miclau, T.; Jayaraman, S.; Campbell, S.; Kojima, K.; Li, W.; Ahmad, A.; Bonney, J.; Kisitu, D.; de Alencar Domingues, C.; Bose, D.; Hotz, H.; Banerjee, A.; Bekele, A.; Joshipura, M.; Roy, N.; Gosselin, R.
In: PLoS ONE . (PLoS ONE, August 2023, 18(8 August))
Conference
In: InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM , Proceedings of the 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, 2023, 2023-May)
Conference
In: InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM , Proceedings of the 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, 2023, 2023-May)
Conference
In: Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022 , Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022. (Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022, 2022)
Conference
In: Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022 , Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022. (Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022, 2022)
Conference
In: Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021 , Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021. (Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021, 2021)
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제한된 항목
[AR] Kisitu, D.
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