학술논문
'학술논문'
에서 검색결과 419건 | 목록
1~10
Academic Journal
Goto, M.; Honda, Y.; Nanba, M.; Iguchi, Y.; Saraya, T.; Kobayashi, M.; Higurashi, E.; Toshiyoshi, H.; Hiramoto, T.
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(9):4705-4711 Sep, 2023
Conference
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :99-100 May, 2022
Conference
2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :69-70 May, 2021
Conference
2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2018 Symposium on. :1-4 May, 2018
Academic Journal
Honda, Y.; Goto, M.; Watabe, T.; Hagiwara, K.; Nanba, M.; Iguchi, Y.; Saraya, T.; Kobayashi, M.; Higurashi, E.; Toshiyoshi, H.; Hiramoto, T.
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(9):1904-1911 Sep, 2019
Academic Journal
In: Applied Physics Letters . (Applied Physics Letters, 30 January 2023, 122(5))
Academic Journal
In: Journal of Japan Institute of Electronics Packaging . (Journal of Japan Institute of Electronics Packaging, 2023, 26(5):427-433)
Academic Journal
In: Microsystems and Nanoengineering . (Microsystems and Nanoengineering, December 2022, 8(1))
Academic Journal
In: Sensors . (Sensors, November 2022, 22(21))
Conference
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :11-11 Oct, 2021
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제한된 항목
[AR] Higurashi, E.
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