학술논문
'학술논문'
에서 검색결과 17건 | 목록
1~20
Academic Journal
Wagner, Stefan ; Strunčnik, Julija ; Schönbacher, Lara ; Gschwandl, Mario ; Fischlschweiger, Michael ; Zeiner, Tim
In Fluid Phase Equilibria July 2025 594
Conference
Hollinger, Thomas Harald; Kasinikota, Venu; Lang, Margit; Fuchs, Peter; Gschwandl, Mario; Ziegelwanger, Harald
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-9 Apr, 2025
Academic Journal
Schipfer, Christian; Gschwandl, Mario; Fuchs, Peter; Antretter, Thomas; Feuchter, Michael; Morak, Matthias; Tao, Qi; Schingale, Angelika
In Microelectronics Reliability December 2022 139
Academic Journal
Gschwandl, Mario; Friedrich, Birgit; Pfost, Martin; Antretter, Thomas; Fuchs, Peter Filipp; Mitev, Ivaylo; Tao, Qi; Schingale, Angelika
In Microelectronics Reliability June 2022 133
Academic Journal
Kaiser, Simon; Novak, Patrick; Giebler, Michael; Gschwandl, Mario; Novak, Philipp; Pilz, Gerald; Morak, Matthias; Schlögl, Sandra
In Polymer 9 September 2020 204
Conference
Peng, Chongnan; Morak, Matthias; Thalhamer, Andreas; Gschwandl, Mario; Fuchs, Peter; Tao, Qi; Krivec, Thomas; Antretter, Thomas; Celigueta, Miguel Angel
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-7 Apr, 2022
Conference
Schipfer, Christian; Gschwandl, Mario; Fuchs, Peter; Antretter, Thomas; Feuchter, Michael; Morak, Matthias; Tao, Qi; Schingale, Angelika
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-8 Apr, 2021
Conference
Gschwandl, Mario; Pfost, Martin; Antretter, Thomas; Fuchs, Peter Filipp; Mitev, Ivaylo; Tao, Qi; Schingale, Angelika
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-8 Apr, 2021
Conference
Yalagach, Mahesh; Filipp Fuchs, Peter; Wolfberger, Archim; Gschwandl, Mario; Antretter, Thomas; Feuchter, Michael; Tak, Coen; Tao, Qi
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2029-2035 May, 2019
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Conference
Gschwandl, Mario; Fuchs, Peter Filipp; Antretter, Thomas; Pfost, Martin; Mitev, Ivaylo; Qi, Tao; Krivec, Thomas; Schingale, Angelika; Decker, Michael
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1509-1514 May, 2019
Conference
Gschwandl, Mario; Frewein, Markus; Fuchs, Peter Filipp; Antretter, Thomas; Pinter, Gerald; Novak, Philipp
2018 20th International Conference on Electronic Materials and Packaging (EMAP) Electronic Materials and Packaging (EMAP), 2018 20th International Conference on. :1-4 Dec, 2018
Conference
Gschwandl, Mario; Fuchs, Peter Filipp; Mitev, Ivaylo; Yalagach, Mahesh; Antretter, Thomas; Qi, Tao; Schingale, Angelika
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-8 Dec, 2017
Academic Journal
Wagner, Stefan; Nagl, Roland; Weissensteiner, Alexander; Strunčnik, Julija; Schönbacher, Lara; Gschwandl, Mario; Fischlschweiger, Michael; Zeiner, Tim
Conference
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :497-500 Nov, 2016
Academic Journal
Wagner, Stefan; Nagl, Roland; Weissensteiner, Alexander; Struncnik, Julija; Schoenbacher, Lara; Gschwandl, Mario; Fischlschweiger, Michael; Zeiner, Tim
Academic Journal
Morak, Matthias; Marx, Philipp; Gschwandl, Mario; Fuchs, Peter Filipp; Pfost, Martin; Wiesbrock, Frank
Academic Journal
Marx, Philipp; Morak, Matthias; Gschwandl, Mario; Fuchs, Peter; Antretter, Thomas; Pfost, Martin; Kern, Wolfgang; Wiesbrock, Frank
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제한된 항목
[AR] Gschwandl, Mario
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