학술논문
'학술논문'
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Conference
Provias, A.; Knobloch, T.; Kitamura, A.; O'Brien, K. P.; Dorow, C. J.; Waldhoer, D.; Stampfer, B.; Penumatcha, A. V.; Lee, S.; Ramamurthy, R.; Clendenning, S.; Waltl, M.; Avci, U.; Grasser, T.
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Academic Journal
Mameli, A.; Shen, J.; Tapily, K.; Clark, R.; Leusink, G.; Roozeboom, F.; Lu, M.; Semproni, S.P.; Chen, J.-R.; Clendenning, S.; O’Meara, D.
In: ACS Applied Materials and Interfaces . (ACS Applied Materials and Interfaces, 20 March 2024, 16(11):14288-14295)
Academic Journal
Dorow, C.; O'Brien, K.; Naylor, C.H.; Lee, S.; Penumatcha, A.; Hsiao, A.; Tronic, T.; Christenson, M.; Maxey, K.; Zhu, H.; Oni, A.; Alaan, U.; Gosavi, T.; Gupta, A.S.; Bristol, R.; Clendenning, S.; Metz, M.; Avci, U.
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(12):6592-6598 Dec, 2021
Conference
Dorow, C. J.; O'Brien, K. P.; Naylor, C. H.; Lee, S.; Penumatcha, A.; Hsiao, A.; Tronic, T.; Christenson, M.; Maxey, K.; Zhu, H.; Oni, A.; Alaan, U. S.; Gosavi, T. A.; Gupta, A. Sen; Bristol, R.; Clendenning, S.; Metz, M.; Avci, U. E.
2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021
Conference
O'Brien, K. P.; Dorow, C. J.; Penumatcha, A.; Maxey, K.; Lee, S.; Naylor, C. H.; Hsiao, A.; Holybee, B.; Rogan, C.; Adams, D.; Tronic, T.; Ma, S.; Oni, A.; Gupta, A. Sen; Bristol, R.; Clendenning, S.; Metz, M.; Avci, U.
2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :7.1.1-7.1.4 Dec, 2021
Conference
Huang, C. -Y.; Dewey, G.; Mannebach, E.; Phan, A.; Morrow, P.; Rachmady, W.; Tung, I. -C.; Thomas, N.; Alaan, U.; Paul, R.; Kabir, N.; Krist, B.; Oni, A.; Mehta, M.; Harper, M.; Nguyen, P.; Keech, R.; Vishwanath, S.; Cheong, K. L.; Kang, J. S.; Lilak, A.; Metz, M.; Clendenning, S.; Turkot, B.; Schenker, R.; Yoo, H. J.; Radosavljevic, M.; Kavalieros, J.
2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :20.6.1-20.6.4 Dec, 2020
Academic Journal
O’Brien, K.P.; Naylor, C.H.; Dorow, C.; Maxey, K.; Penumatcha, A.V.; Vyatskikh, A.; Zhong, T.; Kitamura, A.; Lee, S.; Rogan, C.; Mortelmans, W.; Kavrik, M.S.; Steinhardt, R.; Buragohain, P.; Dutta, S.; Tronic, T.; Clendenning, S.; Fischer, P.; Putna, E.S.; Radosavljevic, M.; Metz, M.; Avci, U.
In: Nature Communications . (Nature Communications, December 2023, 14(1))
Conference
Dorow, C.J.; O'Brien, K.P.; Naylor, C.H.; Lee, S.; Penumatcha, A.; Hsiao, A.; Tronic, T.; Christenson, M.; Maxey, K.; Zhu, H.; Oni, A.; Alaan, U.S.; Gosavi, T.A.; Gupta, A.S.; Bristol, R.; Clendenning, S.; Metz, M.; Avci, U.E.
In: Digest of Technical Papers - Symposium on VLSI Technology , 2021 Symposium on VLSI Technology, VLSI Technology 2021. (Digest of Technical Papers - Symposium on VLSI Technology, 2021, 2021-June)
Conference
In: Advanced Metallization Conference (AMC) , Advanced Metallization Conference 2011. (Advanced Metallization Conference (AMC), 2011, :10-11)
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[AR] Clendenning, S.
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