학술논문
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Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(10):1603-1612 Oct, 2023
Academic Journal
IEEE Transactions on Signal and Power Integrity IEEE Trans. Signal and Power Integr. Signal and Power Integrity, IEEE Transactions on. 1:22-31 2022
Academic Journal
IEEE Transactions on Signal and Power Integrity IEEE Trans. Signal and Power Integr. Signal and Power Integrity, IEEE Transactions on. 1:160-169 2022
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(9):1369-1379 Sep, 2021
Academic Journal
IEEE Access Access, IEEE. 8:74339-74348 2020
Academic Journal
Ranoa, D.R.E.; Green, K.J.; Hergenrother, P.J.; Burke, M.D.; Maslov, S.; Moore, J.S.; Fouke, B.W.; Brooke, C.B.; Smith, R.L.; Goldenfeld, N.; Fan, T.M.; Holland, R.L.; Alnaji, F.G.; Breitbarth, J.; Simpson, C.; Johnson, M.; Banks, K.M.; Eardley, J.; Healy, R.M.; McGuffin, R.; Sherwood, M.E.; Skadden, C.; White, K.C.; Wang, L.; Fredrickson, R.L.; Steinman, J.D.; Dohrer, K.; Edwards, A.; Eggett, T.; Smith, C.; Vlach, E.; Wang, T.; Wong, G.N.; Weiner, Z.J.; Uelmen, J.; Best-Popescu, C.; Valera, E.A.; Tkachenko, A.V.; Zhang, H.; Liu, Z.; Ibrahim, A.; Elbanna, A.; Patel, S.J.; Miller, A.; Paul, J.M.; Durack, G.; Vozenilek, J.A.; Bashir, R.; Vance, N.P.; Gulick, J.G.; Galvan, I.J.; Nelson, T.J.; Stevens, M.P.; Kindle, L.M.; Satheesan, S.P.; McHenry, K.G.; Grohens, J.; Hennessy, P.M.; Parker, R.C.; Fenner, M.R.; Phillips, J.M.; Stech, M.; Santos, E.; Brackett, C.; DeLorenzo, M.; Wilhelm-Barr, L.; Ward, W.E.; Kielbasa, A.; Simon, A.; Jones, R.J.; Brauer, B.R.; Wetter, N.; Kranz, D.M.; Pryde, J.A.; Vaid, A.; Kaler, R.N.; Harris, C.; Vance, A.C.; Silotto, J.L.; Anton, P.K.; Mwilambwe, L.; Young, D.B.; Bryan, S.P.; Lantz, J.; Cohen, N.J.; Holterman, A.A.; Stone, D.S.; Garg, M.; Cooper, J.C.; Parikh, N.A.; Snyder, G.; Lore, M.H.; Yocum, D.L.; Novakofski, J.E.; Loots, M.J.; Martinis, S.A.; Ballard, R.L.; Busch, J.; Mayes, J.; Band, M.; Lipking, R.L.; Rye, L.N.; Skelton, T.H.; Barnes, J.D.; Fleurimont, J.; Gray, B.; Jasenof, I.; Mumford, M.; Munoz, K.; Watson, K.; Bentea, I.; Ismail, N.; Black, J.; Curry, M.; Glueck, D.; Moseley, J.; Murray, A.D.; Conte, A.; Gastala, N.; Pekosz, A.; Conte, M.; Manabe, Y.C.; Mirza, A.; Robinson, M.L.; Foster, D.; Gallagher, N.; Mostafa, H.H.; Genung, S.A.; Thomas, R.; Greta, A.; Watkins, R.S.; Hetrick, A.; Kelly, P.; Kiesel, T.; Pitts, C.; Nolan, M.; Pflugmacher, J.; Potter, M.C.; Quisenberry, J.; Singson, J.M.; Rear, J.; Rosillo, E.; Walsh, J.T.; Tomaszewski, M.A.; Tyburski, E.A.; Vanwingerden, S.; Killeen, T.L.; Cangellaris, A.C.; Sullivan, W.C.
In: Nature Communications . (Nature Communications, December 2022, 13(1))
Conference
Chew, W.C.; Cangellaris, A.C.; Schutt-Aine, J.; Braunisch, H.; Qian, Z.G.; Aydiner, A.A.; Aygun, K.; Jiang, L.J.; Ma, Z.H.; Meng, L.L.; Naeem, M.
2013 17th IEEE Workshop on Signal and Power Integrity Signal and Power Integrity (SPI), 2013 17th IEEE Workshop on. :1-4 May, 2013
Conference
Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :716-721 2005
Conference
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Electromagnetic Compatibility Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on. 2:666-671 2005
Conference
2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. Electromagnetic Compatibility Electromagnetic Compatibility, 2005. EMC 2005. 2005 International Symposium on. 3:817-822 Vol. 3 2005
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제한된 항목
[AR] Cangellaris, A.C.
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