학술논문

Micromechanism for Copper-Deficiency Enhanced Stability: A Quasi In SituTEM Study of Electric-Induced Structural Evolution in Cu2–x(S, Se) Liquid-Like Thermoelectric Materials
Document Type
Article
Source
Nano Letters; March 2024, Vol. 24 Issue: 9 p2853-2860, 8p
Subject
Language
ISSN
15306984; 15306992
Abstract
Cu-based liquid-like thermoelectric materials have garnered tremendous attention due to their inherent ultralow lattice thermal conductivity. However, their practical application is hampered by stability issues under a large current or temperature gradient. It has been reported that introduction of copper vacancies can enhance the chemical stability, whereas the micromechanism behind this macroscopic improvement still remains unknown. Here, we have established a quasi in situTEM method to examine and compare the structural evolution of Cu2–xS0.2Se0.8(x= 0, 0.05) under external electric fields. It is then found that the preset Cu vacancies could favor the electric-induced formation of a more stable intermediate phase, i.e., the hexagonal CuSe-type structure in the form of either lamellar defects (majorly) or long-range order (minorly), in which ordering of S and Se also occurred. Thereby, copper and chalcogen atoms could largely be solidified into the matrix, and the elemental deposition and evaporation process is mitigated under an electric field.