학술논문
Vapor cooling device for semiconductor device
Document Type
Patent
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Abstract
A semiconductor device is immersed into a cooling medium in its liquid phase disposed in a vessel. The cooling medium changes to its vapor phase due to heat from the semiconductor device to enter a condenser located above the vessel. The cooling medium condensed in the condenser passes through a conduit connected to the lower portion of the vessel to be directly mixed with the liquid cooling medium within the vessel.