학술논문
Microwave circuits in multilayer ORMOCER® thin film
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Electronic Resource
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Abstract
A multilayer sequential build-up structure for the integration of passivemicrowave devices is presented. The different devices were processed byusing a photo-patternable polymer ORMOCER together with conducting layersof Cu on top of a FR-4 substrate. Microstrip and stub structures have beencharacterised at frequencies between 1 to 40 GHZ showing the feasibility ofusing this kind of material and build-up technology for microwaveapplications.