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Effect of Molecular Weight on the Morphology of a Polymer Semiconductor–Thermoplastic Elastomer Blend

Document Type

Article

Author

Peña-Alcántara, A.; Ponte, E.; Nikzad, S.; Michalek, L.; Gong, H.; Wu, Y.; Root, S.E.; Tok, J.B.H.; Bao, Z.; Prine, N.; Wang, Y.; Gu, X.; Schneider, S.; He, M.

Source

In: Advanced Electronic Materials. (Advanced Electronic Materials, September 2023, 9(9))

Subject

Language

English

ISSN

2199160X

Online Access

Full Text (Wiley Journals) Open Access (Wiley) Web of Science JCR 저널정보 Scopus Find it@PNU

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