학술논문
Electromigration in Solder Joints Using Sn-3.0Cu Solder in Power Modules
Document Type
Article
Author
Source
In: Journal of Japan Institute of Electronics Packaging . (Journal of Japan Institute of Electronics Packaging, 2023, 26(1):110-116)
Subject
Language
English
Japanese
Japanese
ISSN
1884121X
13439677
13439677