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Etch characteristics of Si and TiO2 nanostructures using pulse biased inductively coupled plasmas

Document Type

Article

Author

Kim, S.-G.; Yeom, G.-Y.; Yang, K.-C.; Shin, Y.-J.; Kim, D.-W.; Kim, K.-N.; Lee, J.Y.; Kim, Y.

Source

In: Nanotechnology. (Nanotechnology, 9 April 2020, 31(26))

Subject

Language

English

ISSN

13616528
09574484

Online Access

Full Text (IOP Science) Full Text (IOP) Web of Science JCR 저널정보 Scopus Find it@PNU

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