학술논문

Thermally stimulated depolarization current - characterization of a multi-layer dielectric stack for semiconductor packages
Document Type
Conference
Source
2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) Advanced Semiconductor Devices and Microsystems (ASDAM), 2022 14th International Conference on. :1-5 Oct, 2022
Subject
Components, Circuits, Devices and Systems
Photonics and Electrooptics
Signal Processing and Analysis
Temperature measurement
Micromechanical devices
Temperature distribution
Semiconductor device measurement
Semiconductor devices
Polyimides
Glass
Language
ISSN
2474-9737
Abstract
In this paper, the results of Thermally Stimulated Depolarization Currents (TSDC)-measurements of a complex system of stacked dielectric layers, like typically appearing in semiconductor packages, is presented. Characteristics of the individual isolation layers are presented solely and the results are compared to the stack. The investigated layers are comprising polyimide film, alkali-free glass, polyolefin film and epoxy based mold compound. Measurements have been carried out in the temperature range from 19 - 195°C at varying polarization fields for every material. Various relaxation peaks, originated by different polarization mechanisms within the materials could be observed. A comparison between the TSDC-peaks of the layer stack and the individual materials is shown. Our results demonstrate, that the super positioned spectrum is getting dominated by a single portion, the mold compound.