학술논문

Step and Repeat Imprint Lithography for Wafer Scale Mastering of Micro-and Nanostructures
Document Type
Conference
Source
2022 International Semiconductor Conference (CAS) Semiconductor Conference (CAS), 2022 International. :69-72 Oct, 2022
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Shape
Semiconductor device reliability
Lithography
Production
Turning
Surface roughness
Rough surfaces
step and repeat
Nanoinprint Lithography
SmartNIL
UV molding
metalens
photonics
Language
ISSN
2377-0678
Abstract
Step and Repeat UV Imprint Lithography provides a flexible and low-cost pattern replication technique for upscaling from single devices to wafer level scale. Multiple copies of lens and mirror type structures have been investigated with focus on pattern shape, size and surface quality. The flexibility of this method demonstrating a reliable replication process over a high number of copies was shown for imprinting different patterns with different lateral dimensions from mm range down to sub-100nm resolution. It has to be highlighted that use of a Meta-type lenses could be used for this process as well and thus providing a viable scaling method for this new class of optical components. Master templates are fabricated by diamond turning two-photon polymerization or e-beam lithography and etching on single die basis. Then step and repeat replication provides an attractive solution for scaling sophisticated designs. Finally, the use of such step and repeat wafer for high volume production was shown by means of SmartNIL® replication at wafer level scale demonstrating reliable pattern shapes and surface quality.