학술논문

Terahertz Oscillator Chips Backside-Coupled to Unclad Microphotonics
Document Type
Periodical
Source
IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 29(3: Photon. Elec. Co-Inte. and Adv. Trans. Print.):1-10 Jun, 2023
Subject
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Substrates
Silicon
Oscillators
Hollow waveguides
Antennas
Optical waveguides
Dipole antennas
Oscillator
photonics
resonant tunneling diode
terahertz
transfer process
waveguide
Language
ISSN
1077-260X
1558-4542
Abstract
Terahertz technology is largely dependent upon planar on-chip antennas that radiate downwards through the substrate, and so an effective means to interface these antennas with integrated waveguides is an attractive prospect. We present a viable methodology for backside coupling between a terahertz oscillator chip and a broadband all-intrinsic-silicon dielectric waveguide. Our investigation employs resonant tunneling diodes as compact two-terminal electronic terahertz oscillators, and terahertz waves are observed from 270 GHz to 404 GHz. The fact that this power is accessed via a curved length of silicon waveguide validates successful backside coupling.