학술논문
Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films
Document Type
Conference
Author
Source
2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2022 IEEE 34th International Conference on. :1-4 Mar, 2022
Subject
Language
ISSN
2158-1029
Abstract
This paper presents a previously documented full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. With magnetic films, non-magnetic seed layers need to be as thin as possible to minimise unwanted eddy currents. This paper uses the test structure to quantify the IR drop on the electroplated film and demonstrates how current distribution structures can be simply used to significantly improve wafer plating uniformity when using seed layer thicknesses of a few nanometers.