학술논문
Source Pad Design Tradeoffs for a Power TrenchFET
Document Type
Periodical
Author
Source
IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 35(3):439-445 Aug, 2022
Subject
Language
ISSN
0894-6507
1558-2345
1558-2345
Abstract
This paper will demonstrate wirebond pad design considerations for the source pad of a power trenchFET using three levels of metal. There will be a discussion of how the pad design will impact the pad mechanical strength through the bonding process. Both Aluminum-Copper (AlCu) and Damascene Copper power metals have been investigated. There will also be a comparison of bondpad design to electrical simulation results. An optimal design can be obtained by an analysis of these tradeoffs. Finally, the proposed designs have been built on silicon and evaluated both mechanically and electrically concluding with the best design found for this application.