학술논문
Effects of Temperature and Structural Geometries on a Skyrmion Logic Gate
Document Type
Periodical
Author
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(4):1706-1712 Apr, 2022
Subject
Language
ISSN
0018-9383
1557-9646
1557-9646
Abstract
We design a skyrmion-magnetic domain interconversion logic gate (SkyMDILogic) gate and use it as a model system to study the geometrical and thermal effects. We particularly focus on the effects of temperature and structural defects. Micromagnetic simulations are used to study the skyrmion movement and characterize the relevant properties. We also construct an equivalent circuit model to calculate the energy consumption and logic operations at different temperatures. We find that temperature significantly affects the stability of a skyrmion. At elevated temperatures, the skyrmion propagation is more robust against the pinning effect of structural defects. Our results highlight the effects of thermal and structural defects, which remained largely unexplored in previous logic gate designs.