학술논문

A 0.18 /spl mu/m SiGe:C RFBiCMOS technology for wireless and gigabit optical communication applications
Document Type
Conference
Source
Proceedings of the 2001 BIPOLAR/BiCMOS Circuits and Technology Meeting (Cat. No.01CH37212) Bipolar/BiCMOS circuits and technology Bipolar/BiCMOS Circuits and Technology Meeting, Proceedings of the 2001. :151-154 2001
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Optical fiber communication
CMOS technology
Heterojunction bipolar transistors
Isolation technology
MOS devices
Space technology
Integrated circuit technology
CMOS process
Metallization
Signal design
Language
Abstract
A fully modular 0.18 /spl mu/m SiGe:C RFBiCMOS technology is described which has been developed for wireless and gigabit optical communication applications. This technology is based upon a 0.18 /spl mu/m low-power CMOS platform with dual gate oxide MOS devices and 5 layers of Cu metallization. Low Vt CMOS, isolated NMOS, analog BJT and high quality passive devices are integrated for mixed signal and RFCMOS design capability. In addition, a SiGe:C HBT device is integrated for high frequency, low power and low noise RFBiCMOS applications. This technology is supported by digital and analog libraries including 1/f noise & matching characterization, parasitic extraction and memory compilation to fully enable complex mixed-signal system designs.