학술논문

Circuit reliability prediction: challenges and solutions for the device time-dependent variability characterization roadblock
Document Type
Conference
Source
2021 IEEE Latin America Electron Devices Conference (LAEDC) Electron Devices Conference (LAEDC), 2021 IEEE Latin America. :1-4 Apr, 2021
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Photonics and Electrooptics
Power, Energy and Industry Applications
Signal Processing and Analysis
Semiconductor device modeling
MOSFET
Software algorithms
Predictive models
Reliability engineering
Software
Software reliability
Time-dependent variability
CMOS technology
RTN
aging
BTI
HCI degradation
characterization
Language
Abstract
The characterization of the MOSFET Time-Dependent Variability (TDV) can be a showstopper for reliability-aware circuit design in advanced CMOS nodes. In this work, a complete MOSFET characterization flow is presented, in the context of a physics-based TDV compact model, that addresses the main TDV characterization challenges for accurate circuit reliability prediction at design time. The pillars of this approach are described and illustrated through examples.