학술논문

Effect of Pressure and Temperature on Dielectric Response of Silicone Composites
Document Type
Conference
Source
2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) Electrical Insulation and Dielectric Phenomena (CEIDP), 2020 IEEE Conference on. :346-349 Oct, 2020
Subject
Engineered Materials, Dielectrics and Plasmas
Silicon compounds
Performance evaluation
Insulation
Micrometers
Temperature
Dielectrics
Thermal analysis
Language
ISSN
2576-2397
Abstract
Use of lightweight polymeric materials in aircraft insulation, leads to reduction in overall weight as well as aids in improved performance. However, for successful implementation of these polymeric materials, specific studies in terms of, improvement in processability, performance evaluation due to variation in pressure and temperature, are required. In this study, silicone rubber filled with silica of different particle size; micrometer and nanometer are considered, and the fillers are loaded to the maximum possible weight percent. An in-house built electrostatic disperser is employed to homogeneously disperse the fillers within the silicone matrix. The thermal and dielectric properties are compared and analyzed with changes in temperature and pressure.