학술논문
High-Temperature-Stable, Spin-On Carbon Materials for High-Aspect-Ratio Gap-Fill Applications
Document Type
Conference
Source
2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2021 32nd Annual SEMI. :1-4 May, 2021
Subject
Language
ISSN
2376-6697
Abstract
Brewer Science, Inc. has developed a class of novel, high-temperature-stable spin-on carbon (SOC)-based materials with excellent processability. These SOCs are cured under mild conditions and have flow properties that enable the fill of high-aspect-ratio vias in a void-free manner. Moreover, this new class of SOCs has remarkable thermal stability and can survive temperatures of up to 550°C with only minimal shrinkage/mass loss. The properties of these SOCs make them ideal candidates for use in high-temperature processes such as CVD and metal deposition.