학술논문
Fan-Out Panel-Level Packaging of Mini-LED RGB Display
Document Type
Periodical
Author
Source
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(5):739-747 May, 2021
Subject
Language
ISSN
2156-3950
2156-3985
2156-3985
Abstract
In this study, the feasibility of mini-light-emitting diode (LED) RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED RGB display package on a printed circuit board (PCB). The mini-LEDs under consideration and their sizes are red ( $125 \times 250 \times 100 ~\mu \text{m}$ ), green ( $130 \times 270 \times 100 ~\mu \text{m}$ ), and blue ( $130 \times 270 \times 100 ~\mu \text{m}$ ). The spacing among the RGB mini-LEDs is $80~\mu \text{m}$ , the pixel-to-pixel spacing is also $\sim 80~\mu \text{m}$ , and the pixel pitch is $625~\mu \text{m}$ . The temporary glass panel for making the redistribution layers (RDLs) of the package is $515 \times 510 \times 1.1$ mm in size. To increase the SMT assembly yield on the PCB, the mini-LEDs are grouped into 4( $2 \times 2$ pixels)-in-one surface mount device (SMD), that is, a total of 12 R, B, and G mini-LEDs. A PCB ( $132\,\,mm \times 77$ mm) is designed and fabricated for the drop test of the mini-LED package. Thermal cycling of the mini-LED SMD PCB assembly is also performed by a nonlinear temperature- and time-dependent finite-element simulation.