학술논문

Circuits and technologies for highly integrated optical networking ICs at 10 Gb/s to 40 Gb/s
Document Type
Conference
Source
Proceedings of the IEEE 2001 Custom Integrated Circuits Conference (Cat. No.01CH37169) Custom integrated circuits Custom Integrated Circuits, 2001, IEEE Conference on.. :331-338 2001
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Integrated circuit technology
Integrated optics
Optical fiber networks
CMOS technology
Isolation technology
Silicon germanium
Germanium silicon alloys
BiCMOS integrated circuits
Transceivers
III-V semiconductor materials
Language
Abstract
This paper presents a comparative overview of the performance of Si CMOS, SiGe BiCMOS and III-V HBT and FET technologies for 10-40 Gb/s fiber-optic applications. Active and passive device performance requirements, as well as on-chip isolation issues are first addressed. Fundamental building blocks are overviewed and the pros and cons of each technology implementation are discussed. Finally, a sub 2.5 W, highly integrated 10 Gb/s SiGe BiCMOS implementation of a 10 Gb/s to 622 Mb/s transceiver is described in detail. The transceiver achieves the highest level of integration, providing EOI (electro-optical-interface) and SerDes (Serializer-Deserializer) functions.