학술논문

Thermal Aware Lifetime Reliability Optimization for Automotive Distributed Computing Applications
Document Type
Conference
Source
2020 IEEE 38th International Conference on Computer Design (ICCD) ICCD Conference on Computer Design (ICCD), 2020 IEEE 38th International. :498-505 Oct, 2020
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Integrated circuits
Reliability engineering
Integrated circuit reliability
Task analysis
Thermal stability
Mathematical programming
Genetic algorithms
Automotive reliability
system-level MTTF
Thermal Aware
ECU
ISO 26262
Language
ISSN
2576-6996
Abstract
As the automotive industry is moving towards electric and self-driving vehicles, how to ensure the high degree of reliability for electronic control systems (ECS) has emerged as a serious concern. Temperature plays a vital role in the reliability of ECS because vehicles are subjected to high chip temperature due to harsh operating conditions and high integrated circuit (IC) on-chip power density. In this paper, we study the problem on how to optimize the lifetime reliability and guarantee the chip's peak temperature of ECS by judiciously allocating the application to ECS. We first propose a simple mathematical programming based thermal aware approach, assuming temperature can reach a stable status immediately. We then present a genetic algorithm approach based on effective and computationally efficient methods for peak temperature identification and system-wide lifetime reliability calculation, by taking advantage of the periodicity of vehicle applications. Our experimental results, based on both synthetic test cases and practical benchmarks demonstrate the significant improvement in lifetime reliability and CPU time for automotive ECS achieved by our proposed algorithms compared to the state-of-the-art results.