학술논문

High-Power (>300 mW) On-Chip Laser With Passively Aligned Silicon-Nitride Waveguide DBR Cavity
Document Type
Periodical
Source
IEEE Photonics Journal IEEE Photonics J. Photonics Journal, IEEE. 12(6):1-12 Dec, 2020
Subject
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Stimulated emission
Optical device fabrication
Power lasers
Waveguide lasers
Distributed Bragg reflectors
Optical waveguides
Photonics
Hybrid integration
SiN photonics
external cavity laser
high power laser
Language
ISSN
1943-0655
1943-0647
Abstract
We demonstrate a high-power on-chip 1550-nm laser implemented by passive flip-chip integration of a curved-channel, double-pass InGaAsP/InP slab-coupled optical waveguide amplifier (SCOWA) onto a photonic integrated circuit (PIC) containing a silicon nitride (SiN) waveguide and distributed Bragg reflector (DBR) grating. The combined chip-scale SCOW external cavity laser (SCOWECL) has single mode emission with 312 mW of optical power at a drive current of 2.5 A, and exhibits a side mode suppression ratio (SMSR) of 55 dB, peak photon conversion efficiency (PCE) of 10%, low relative-intensity noise (RIN) of ∼160 dB/Hz, and an integrated linewidth of 192 kHz. Additionally, we demonstrate a multi-wavelength SCOWECL array comprised of four SCOWAs coupled to SiN-waveguide DBR gratings. The four-element array generates 80 mW per channel when the SCOWAs are driven in parallel (1.25 A/channel) with ∼1-nm wavelength spacing centered at 1533 nm. We describe the fabrication and hybrid integration processes. The measured SCOWA-to-waveguide coupling loss is estimated to be 1.6 +/−1.0 dB which agrees well with the simulation.