부산대학교 도서관

To realize additive manufacturing for microwave applications, full component solutions integrated with MMIC amplifiers are needed. A key obstacle is the utilization of multiple materials within integrated 3D printed electronics. The aim of this work is to demonstrate feasibility of printed multi-material structures that perform well at microwave frequencies. To show the efficacy of additive processing and materials for microwave applications, we designed and fabricated a C-Band phased array single element as a demonstration vehicle. We present design, simulated and measured results of the fully printed passive networks as well as characterization of materials and manufacturing processes required to realize a printed C-Band phased array single element. Passive networks are integrated with MMIC amplifiers within the channel. The technical challenges that were overcome include elimination of wirebonds through printed interconnects, fabricating 3-dimensional RF component structures that reduce the x-y footprint for the intended functionality, and creating tunable structures that allow for adaptation during the additive manufacturing process.