학술논문
A Novel All-in-One Digital-Analog Heterogeneous Integrated Intelligent Power Module
Document Type
Conference
Author
Source
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2019 31st International Symposium on. :239-242 May, 2019
Subject
Language
ISSN
1946-0201
Abstract
This paper introduces a novel all-in-one digital-analog heterogeneous integrated intelligent power module (IPM) which is composed of Si MOSFETs, Gate Driver and Micro Controller Unit (MCU). This novel all-in-one module realized by heterogeneous integration offers a System in Package (SiP) solution without causing serious Electromagnetic Compatibility (EMC), signal integrity and thermal issues. In addition, we designed the three-phase half-bridge inverter system formed by this IPM to compare with the system consisting of the same circuit and same bare dies of MOSFETs (TO-package), Gate Driver and MCU (SO-package). The performance shows that the inverter system which adopted this intelligent power module is capable of reducing system energy consumption, enhancing system efficiency (2-4%), and successfully shrinking system volume(>33%) at the same time. Besides, this SiP IPM can improve system reliability, electromagnetic compatibility (EMC) performance and pass the international standard of CISPR 11. Keywords-SiP, heterogeneous integration, IPM, EMC, power density.