학술논문

Dynamics of Patent Collaboration: The Case of Nanocomposite Materials
Document Type
Conference
Source
2017 Portland International Conference on Management of Engineering and Technology (PICMET) Management of Engineering and Technology (PICMET), 2017 Portland International Conference on. :1-7 Jul, 2017
Subject
Aerospace
Bioengineering
Engineering Profession
General Topics for Engineers
Power, Energy and Industry Applications
Transportation
Patents
Collaboration
Composite materials
Nanocomposites
Technological innovation
Data mining
Language
Abstract
Nano-composite materials are reported to be the smartest materials of the century due to the property combinations that were not found in conventional composites. Since nanocomposite materials are at an early phase of their lifecycles, an exploratory analysis on collaborations between actors seem to be important towards the generation and dissemination of the required knowledge for actually benefiting from nanocomposite applications. This study analyses the actors' patent collaboration structures and dynamics, and to identify the determinants of collaboration in the sector. Through the use of tech mining method and patent data on nano-composite materials (multi-dimensional nano-composites and single dimensional nanorods), the paper examines whether such collaborations in nano-composite materials affect national systems of innovation owing to its interdisciplinary type and its dispersion across scientific fields. The results indicate that Asian organizations have a significant advantage in developing strong collaborations networks, with the active involvement of large organisations. Linear (mono-linkage) collaborations among actors in the case of multi-dimensional nano-composites were appeared to be an effective model, revealed the stronger bonds particularly in Japan, China and South Korea. Whilst in single dimensional nanorods' case, more distribute and decentralised collaborations were appeared to be most efficient model, revealed the strongest bonds among actors.