학술논문

Nonplanar focal plane with silicon based photodetector
Document Type
Conference
Source
2017 IEEE Photonics Conference (IPC) Photonics Conference (IPC), 2017 IEEE. :55-56 Oct, 2017
Subject
Components, Circuits, Devices and Systems
Photonics and Electrooptics
Silicon
Polymers
Backplanes
Image sensors
Integrated circuit interconnections
Gold
Photodetectors
Language
Abstract
A fabrication process is demonstrated to form curved image sensors based on CMOS image sensor technology. A stretchable polymer backplane is fabricated monolithically on the backside of the wafer before a DRIE etch is performed to segment the wafer and make the circuit stretchable.