학술논문

SiGe HBT / CMOS process thermal budget co-optimization in a 55-nm CMOS node
Document Type
Conference
Source
2017 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2017 IEEE. :58-61 Oct, 2017
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Fields, Waves and Electromagnetics
General Topics for Engineers
Photonics and Electrooptics
Power, Energy and Industry Applications
Signal Processing and Analysis
Annealing
Heterojunction bipolar transistors
MOSFET
Resistance
Ions
Logic gates
Silicon germanium
Heterojunction Bipolar Transistor (HBT)
Spike Annealing
Dynamic Surface Annealing (DSA)
Language
ISSN
2378-590X
Abstract
This paper deals with the reduction of the process thermal budget in a 55-nm BiCMOS technology for improving SiGe HBTs transit frequency, f T . Since MOSFETs are directly impacted by this modification, process adjustments are implemented to recover performances and parametric yield. Spike annealing temperature reduction, thermal re-oxidation replacement and Dynamic Surface Annealing implementation are discussed. A 355 GHz F t / F Max HBT compatible with current 55-nm MOSFET models is demonstrated.