학술논문

A comparison of air flow and shielding effectiveness of perforated enclosure panels
Document Type
Conference
Source
1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261) Electromagnetic compatibility - Seattle Electromagnetic Compatibility, 1999 IEEE International Symposium on. 2:583-585 vol.2 1999
Subject
Fields, Waves and Electromagnetics
Engineered Materials, Dielectrics and Plasmas
Apertures
Cooling
Electromagnetic compatibility
Clocks
Testing
Silicon
Graphics
Thermal engineering
Design engineering
Attenuation
Language
Abstract
The goals of the thermal engineer and EMC engineer often lead to contradictory design requirements. The EMC engineer wants smaller cooling openings to provide more attenuation of electromagnetic leakage through an enclosure, while the thermal engineer wants larger openings to minimize the restriction of air flow. Previous research on perforated enclosure panels has focused mainly on their EMC performance with little thought given to how they impact the flow of cooling air. This paper addresses this deficiency by examining how the shapes and locations of the perforations also impact these two critical areas.