학술논문

Experimental characterization of elastic-plastic behavior of MEMS electroplated gold specimens
Document Type
Conference
Source
2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2017 Symposium on. :1-4 May, 2017
Subject
Components, Circuits, Devices and Systems
Stress
Loading
Electrodes
Gold
Voltage measurement
Micromechanical devices
Finite element analysis
elastic-plastic behavior
FEM
pull-in voltage
reliability
yield strength
Language
Abstract
This paper presents the design, FEM modeling and experimental characterization of the elastic-plastic behavior of electroplated gold specimens undergoing tensile loading. The test structures are designed and optimized to achieve high stress values in the double-clamped specimen with a rectangular cross-section in the middle of the test structure. High stresses in the specimen are achieved by using electrostatic actuation to the plates, constrained using hinges. The range of electrostatic actuation is increased using bottom partial-plate electrodes on the substrate. The static deflection of the central specimen in the test structures under multiple loading cycles is obtained using experimental characterization and a change in the static pull-in voltage with each loading cycle is observed evaluating the permanent strain due to plasticity.