학술논문

A dual-band wireless power transfer and backscatter communication approach for implantable neuroprosthetic devices
Document Type
Conference
Source
2017 IEEE International Conference on RFID (RFID) RFID (RFID), 2017 IEEE International Conference on. :67-72 May, 2017
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Robotics and Control Systems
Signal Processing and Analysis
Transportation
Implants
Backscatter
Antennas
Integrated circuits
Regulators
Radiofrequency identification
Software
Language
Abstract
We present a dual-band HF and UHF fully-integrated implantable neuroprosthetic testbed. This testbed includes a custom implanted device as well as an external system based on a commercially available USRP B210 software defined radio (SDR) platform. The implanted device integrates a BPSK backscatter uplink rate of 5 Mbps, an HF WPT efficiency of 47% with a power consumption of 1.332 milliwatt. The implanted device measures 25 mm diameter and has a total thickness of 2.8 mm including the printed circuit substrate, antenna, all circuitry, and silicone encapsulation. It supports up to 10 neural and 4 electromyogram (EMG) channels with a sampling rate of 26.1 kHz for the neural channels and 1.628 kHz for the EMG channels. The communication link is shown to have 0% packet error rate at an implant depth of up to 2.5 cm.