학술논문
Test results from the comparison of three liquid cooling methods for high-power processors
Document Type
Conference
Author
Source
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on. :619-624 May, 2016
Subject
Language
ISSN
1087-9870
Abstract
This study compares three different liquid cooling technologies to determine which of the three methods is able to cool the highest power density processor chips.