학술논문
Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
Document Type
Conference
Author
Source
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on. :1-5 Apr, 2014
Subject
Language
Abstract
Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have been also discussed.