학술논문
Reliability improvements in electronic systems by combining condition monitoring approaches
Document Type
Conference
Source
2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :511-516 Apr, 2014
Subject
Language
Abstract
This paper gives an overview of different methods of condition monitoring (parameter measurement, canary principle, life cycle unit). It describes the advantage of combining the condition monitoring (CM) methods to improve the reliability of electronic systems. A workflow to implement CM methods is described as well as different system levels and the associated applicable CM method. The paper concludes with the example of an electronic system and a concept to monitor the whole system by means of all three CM methods.