학술논문
Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law
Document Type
Conference
Author
Source
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-6 Apr, 2014
Subject
Language
Abstract
In this study, an approach for enhanced lifetime modelling of wire bonds has been investigated. Numerical simulations of a 3D wire bond model have been used to acquire a suitable damage parameter. For the lifetime model, a modified Paris law for calculating crack growth per cycle has been employed, to consider the gradual area degradation due to thermo-mechanical loads. With the knowledge of the crack propagation rates, the acquired lifetime model can easily be transferred to different wire bond geometries without repeating the experiments necessary to fit the crack growth parameters.