학술논문
Simulation of an aluminum thick wire bond fatigue crack by means of the cohesive zone method
Document Type
Conference
Author
Source
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-8 Apr, 2013
Subject
Language
Abstract
In this study possibilities are investigated to use the cohesive zone method for numerical calculation of fatigue crack growth through the interface area of aluminum thick wire bond joints. For that purpose a detailed three-dimensional model of a wire bond joint is built. Two approaches are investigated to describe the fatigue crack growth: explicit calculation of a large number of cycles and crack growth prediction using a crack growth law like the Paris' law. Both methods are shown to be theoretically feasible and challenges and limits of the cohesive zone method are described.