학술논문
Terpene cleaning of electronic assemblies
Document Type
Periodical
Author
Source
IEEE Transactions on Components, Hybrids, and Manufacturing Technology IEEE Trans. Comp., Hybrids, Manufact. Technol. Components, Hybrids, and Manufacturing Technology, IEEE Transactions on. 13(4):693-697 Dec, 1990
Subject
Language
ISSN
0148-6411
1558-3082
1558-3082
Abstract
The technology and methods developed to safely spray the semi-aqueous terpene hydrocarbon Bioact EC-7 are described. This technique is used to remove rosin-based solder paste residues after reflow soldering of surface-mount devices to printed circuit board assemblies. The operating experience gained during the implementation of this semi-aqueous terpene hydrocarbon cleaning method is described.ETX