학술논문

Transfer-Printed Microscale Integrated Circuits for High Performance Display Backplanes
Document Type
Periodical
Source
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(12):1916-1922 Dec, 2011
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Substrates
Integrated circuits
Backplanes
Silicon
Active matrix organic light emitting diodes
Glass
Metals
Assembly
backplanes
displays
OLEDs
printed electronics
transfer-printing
Language
ISSN
2156-3950
2156-3985
Abstract
Active-matrix organic light-emitting diode displays have been fabricated using backplanes with transfer-printed microscale silicon integrated circuits (ICs) in place of conventional thin-film transistors. The ICs were fabricated using a commercially available semiconductor foundry process, and the wafers were subsequently processed to prepare the ICs for transfer-printing. The microscale ICs were transfer printed onto glass substrates and interconnected using a single-level, thin-film metallization process. The resulting OLED display exhibited good pixel-to-pixel luminance uniformity, high luminance, excellent controllability and high switching speed. The transfer-printing process achieved good positional accuracy and high yield.