학술논문

Backside reflectance modulation of microscale metal interconnects
Document Type
Conference
Source
2011 International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2011 IEEE International. :FA.4.1-FA.4.6 Apr, 2011
Subject
Power, Energy and Industry Applications
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
General Topics for Engineers
Communication, Networking and Broadcast Technologies
Computing and Processing
Reflectivity
Substrates
Temperature measurement
Metals
Silicon
Measurement by laser beam
Absorption
laser reflectance
metal interconnect
substrate thickness
Language
ISSN
1541-7026
1938-1891
Abstract
The variation of backside reflectance modulation effects on metal line samples at different electrical bias and silicon backside thicknesses is investigated. Negative reflected intensity modulation is observed with temperature increase which is one to two orders of magnitude higher than published results. A backside reflectance model is developed to explain the experimental results.