학술논문
3D integration infrastructure & market status
Document Type
Conference
Author
Source
2010 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2010 IEEE International. :1-34 Nov, 2010
Subject
Language
Abstract
A collection of slides for the author's conference is presented. Topic discussed is about 3D integration infrastructure and its market status.