학술논문

Resolution and sensitivity enhancements of scanning optical microscopy techniques for integrated circuit failure analysis
Document Type
Conference
Source
2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the. :11-18 Jul, 2009
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
General Topics for Engineers
Optical microscopy
Integrated optics
Optical sensors
Photonic integrated circuits
Failure analysis
Optical refraction
Stimulated emission
Lenses
Solid lasers
Circuit faults
Language
ISSN
1946-1542
1946-1550
Abstract
Scanning optical microscopy techniques are effective for optical fault localization of failures that are sensitive to thermal stimulation. In this paper, the recent developments in resolution and sensitivity enhancements that allow these techniques to be used with advanced technology nodes are described. The enhancement methods include refractive solid immersion lens technology, dc-coupling of the laser induced detection system and laser pulsing with signal integration algorithm. The combination of these enhanced scanning optical microscopy techniques and refractive solid immersion lens technology has brought about significantly better localization precision and sensitivity.