학술논문

Ultimate contact resistance scaling enabled by an accurate contact resistivity extraction methodology for sub-20 nm node
Document Type
Conference
Source
2009 Symposium on VLSI Technology VLSI Technology, 2009 Symposium on. :102-103 Jun, 2009
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Computing and Processing
Signal Processing and Analysis
Contact resistance
Conductivity
CMOS technology
CMOS process
Resistors
Silicides
Testing
Implants
Electrical resistance measurement
Semiconductor device manufacture
Language
ISSN
0743-1562
2158-9682
Abstract
The S/D-to-silicide contact resistivity is accurately extracted from state-of-the-art CMOS devices based on a new extraction methodology featuring parasitic and geometric corrections. With this sensitive extraction methodology and advanced S/D formation processes, low 10 −8 Ω-cm 2 CMOS contact resistivity meeting 2007 ITRS projection for sub-20 nm technologies is demonstrated. In the quest for less dominant contact resistance and therefore lower overall parasitic resistance, this work also reveals that the scaling of plug-to-spacer pitch and S/D sheet resistance becomes equally crucial as the scaling of contact resistivity.