학술논문

High-Temperature Microwave Performance of Submicron AlGaN/GaN HEMTs on SiC
Document Type
Periodical
Source
IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 30(8):808-810 Aug, 2009
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Aluminum gallium nitride
Gallium nitride
HEMTs
MODFETs
Silicon carbide
Temperature
Radio frequency
Electron mobility
Finite element methods
Equivalent circuits
high temperature (HT)
high-electron-mobility transistor (HEMT)
microwave performance
Language
ISSN
0741-3106
1558-0563
Abstract
The effect of temperature on the small-signal radio-frequency (RF) performance of submicron AlGaN/GaN high-electron-mobility transistors on SiC has been studied from room temperature (RT) up to 600 K. A relation between ambient and channel temperatures has been established by means of finite-element simulations. The thermal behavior of the intrinsic parameters $C_{\rm gs}$, $C_{\rm gd}$, $g_{m, {\rm int}}$, and $g_{\rm ds}$ has been extracted accurately from RF measurements by means of the small-signal equivalent circuit. Main dc parameters $(I_{D}, g_{m, {\rm ext}})$ show reductions close to 50% between RT and 600 K, mainly due to the decrease in the electron mobility and drift velocity. In the same range, $f_{T}$ and $f_{\max}$ suffer a 60% decrease due to the reduction in $g_{m, {\rm ext}}$ and a slight increase of $C_{\rm gs}$ and $C_{\rm gd}$. An anomalous thermal evolution of $C_{\rm gd}$ at low $I_{D}$ has been identified, which is indicative of the presence of traps.