학술논문

A Study of NBTI and Short-Term Threshold Hysteresis of Thin Nitrided and Thick Non-Nitrided Oxides
Document Type
Periodical
Source
IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 9(2):106-114 Jun, 2009
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Power, Energy and Industry Applications
Niobium compounds
Titanium compounds
Hysteresis
Thickness measurement
Lead compounds
Negative bias temperature instability
Thermal degradation
Thermal stresses
Stress measurement
Delay
MOSFET
negative bias temperature instability (NBTI)
recovery
relaxation
Language
ISSN
1530-4388
1558-2574
Abstract
Negative bias temperature instability (NBTI) degradation and recovery have been investigated for 7–50-nm non-nitrided oxides and compared to thin 1.8- and 2.2-nm nitrided oxides from a dual work function technology. A wide regime of stress fields from 2.5 to 10 MV/cm has been covered. Thermal activation has been studied for temperatures from 25 $^{\circ}\hbox{C}$ to 200 $^{\circ}\hbox{C}$. The NBTI effect for the nitrided oxide is larger than for non-nitrided oxides. The percentage of threshold shift $\Delta V_{\rm th}$ which is “lost” during a long measurement delay—which is the quantity leading to curved $\Delta V_{\rm th}$ versus stress-time curves and to errors in extrapolated lifetimes—is about equal for nitrided or thick non-nitrided oxides. The fraction of recovered $\Delta V_{\rm th}$ is strongly dependent on stress time but only weakly dependent on stress field. Recovery in thick oxides leads to exactly the same problems as for non-nitrided oxides, and clearly, a fast measurement method is needed. The effect of short-term threshold shifts has been studied for extremely short stress times down to 200 ns.