학술논문

Optimization of Cylindrical Pin-Fin Heat Sinks Using Genetic Algorithms
Document Type
Periodical
Source
IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(1):44-52 Mar, 2009
Subject
Components, Circuits, Devices and Systems
Heat sinks
Genetic algorithms
Entropy
Heat transfer
Microchannel
Friction
Thermal resistance
Surface resistance
Thermal conductivity
Viscosity
Genetic algorithm (GA)
heat sinks
inline
optimization
pin-fins
pressure drop
staggered
thermal resistance
Language
ISSN
1521-3331
1557-9972
Abstract
In this paper, genetic algorithms (GAs) are applied for the optimization of pin-fin heat sinks. GAs are usually considered as a computational method to obtain optimal solution in a very large solution space. Entropy generation rate due to heat transfer and pressure drop across pin-fins is minimized by using GAs. Analytical/empirical correlations for heat transfer coefficients and friction factors are used in the optimization model, where the characteristic length is used as the diameter of the pin and reference velocity used in Reynolds number and pressure drop is based on the minimum free area available for the fluid flow. Both inline and staggered arrangements are studied and their relative performance is compared on the basis of equal overall volume of heat sinks. It is demonstrated that geometric parameters, material properties, and flow conditions can be simultaneously optimized using GA.