학술논문
Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes
Document Type
Conference
Author
Source
2008 2nd Electronics System-Integration Technology Conference Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd. :209-214 Sep, 2008
Subject
Language
Abstract
This paper concerns the use of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste and specifically, the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of paste materials at the molecular level.