학술논문

Round-robin studies of two potential seebeck coefficient standard reference materials
Document Type
Conference
Source
2007 26th International Conference on Thermoelectrics Thermoelectrics, 2007. ICT 2007. 26th International Conference on. :361-365 Jun, 2007
Subject
Computing and Processing
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Signal Processing and Analysis
General Topics for Engineers
Conducting materials
Thermal conductivity
NIST
Standards development
Instruments
Calibration
Thermoelectricity
Conductivity measurement
Electric variables measurement
Electric resistance
Language
ISSN
1094-2734
Abstract
The scientific activities of NIST include the development and distribution of standard reference materials (SRM™) for instrument calibration and inter-laboratory data comparison. Full characterization of a thermoelectric material requires measurement of the electrical resistivity, thermal conductivity, and Seebeck coefficient. While standard reference materials exist or have existed for the first two properties, Seebeck coefficient standard reference materials are not available. In an effort to expedite research efforts in this field, we have initiated a project to develop a Seebeck coefficient SRM™ material. Currently, we have completed a round-robin measurement survey of two candidate materials, Bi 2 Te 3 and constantan (55% Cu and 45% Ni). In this paper, we summarize our plan and development effort, including the results and the methodology used for the round-robin measurement survey.